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.039″ (1.00mm) FFC/FPC Non-ZIF SMT Type Wafers
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.039″ (1.00mm) FFC/FPC Non-ZIF SMT Type Wafers
October 7, 2015
by
Site Mediator
Headers, Housings, Shunts and Receptacles
.039″ (1.00mm) FFC/FPC Non-ZIF SMT Type Wafers
Specifications
Downloads
Poles:
3-32
Voltage Rating:
250VAC/VDC
Current Rating:
0.5 amps AC/DC
Withstanding Voltage:
500VAC for 1 min.
Insulation Resistance:
1000 megohms min.
Temperature Range:
-40C to +105C
PCB Thickness:
.063″ (1.6mm)
Contact Resistance:
Initial: 10 milliohms max.
After Testing: 20 milliohms max.
WAFER
Poles:
3-32
Material:
Post: Brass, Tin plated
Base: Thermoplastic UL94V-0
Color:
Black
JS-1157 wafer, side entry
JS-1158 wafer, top entry
Headers, Housings, Shunts and Receptacles
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