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.049″ (1.25mm) FFC/FPC ZIF DIP Wafers
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.049″ (1.25mm) FFC/FPC ZIF DIP Wafers
October 7, 2015
by
Site Mediator
Headers, Housings, Shunts and Receptacles
.049″ (1.25mm) FFC/FPC ZIF DIP Wafers
Specifications
Downloads
Poles:
4-30
Current Rating:
1 amp AC/DC
Withstanding Voltage:
500VAC for 1 min.
Insulation Resistance:
1000 megohms min.
Temperature Range:
-45C to +105C
PCB Thickness:
.063″ (1.6mm)
Contact Resistance:
Initial: 10 milliohms max. After Testing: 20 milliohms max.
WAFER
Poles:
4-30
Material:
Post: Brass, Tin Plated
Base: Thermoplastic UL94V-0
Wafer 180 Degrees (JS-1155)
Wafer 90 Degrees (JS-1155R)
Headers, Housings, Shunts and Receptacles
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