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.039″ (1.00mm) FFC/FPC Non-ZIF DIP Wafers
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.039″ (1.00mm) FFC/FPC Non-ZIF DIP Wafers
October 7, 2015
by
Site Mediator
Headers, Housings, Shunts and Receptacles
.039″ (1.00mm) FFC/FPC Non-ZIF DIP Wafers
Specifications
Downloads
Poles:
3-32
Current Rating:
0.5 amp AC/DC
Withstanding Voltage:
500VAC for 1 min.
Insulation Resistance:
1000 megohms min.
Temperature Range:
-25C to +85C
PCB Thickness:
.063″ (1.6mm)
Contact Resistance:
Initial: 10 milliohms max. After Testing: 20 milliohms max.
WAFER
Poles:
3-32
Material:
Base: Thermoplastic UL94V-0
Vertical Wafer (JS-1156)
Right-Angle Wafer R/A (JS-1156R)
Vertical Wafer (JS-1156V)
Surface Mount Wafer (JS-1156S)
Headers, Housings, Shunts and Receptacles
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