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.020″ (0.5mm) Pitch FFC/FPC Non-ZIF SMT Type Wafers
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.020″ (0.5mm) Pitch FFC/FPC Non-ZIF SMT Type Wafers
October 12, 2015
by
Site Mediator
Headers, Housings, Shunts and Receptacles
.020″ (0.5mm) Pitch FFC/FPC Non-ZIF SMT Type Wafers
Specifications
Downloads
Poles:
6-53
Voltage Rating:
200VAC/VDC
Current Rating:
0.3 amps AC/DC
Withstanding Voltage:
200 VAC for 1 min.
Insulation Resistance:
500 megohms min.
Temperature Range:
-40C to +105C
Contact Resistance:
Initial: 10 milliohms max.
After Testing: 20 milliohms max.
WAFER
Poles:
6-53
Material:
Post: Brass Tin plated
Base: Thermoplastic UL94V-0
JS-1190T1 Wafer Top Entry
JS-1191V Vertical Wafer
Wafer Dimensions
Headers, Housings, Shunts and Receptacles
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